Cybersolv C8882

PRODUCT
Cybersolv C8882

MANUFACTURER
Kyzen

TARGET TO BE REMOVED
Flux residual & Solder paste

CERTIFICATE
GreenScreen Certified Gold

EXPIRATION
7/31/2027

CLEANING METHOD - AUTOMATIC OR MANUAL
Automated understencil wipe processes, hand-wipe, and ultrasonic cleaning systems as well as spray systems

CONCENTRATION
100%

OBJECTS
stencils, mis-printed PCBs, stencil tools and printing squeegees

MATERIAL COMPATIBILITY
wetted components in automated understencil wipe systems

PRODUCT DESCRIPTION
CYBERSOLV C8882 is a solvent-based stencil cleaning fluid specifically designed to clean solder paste, uncured SMT adhesive and flux residue from stencils, mis-printed PCBs, stencil tools and printing squeegees. C8882 can be used in automated understencil wipe processes, hand-wipe, and ultrasonic cleaning systems as well as spray systems designed for solvent.

CYBERSOLV C8882 has a mild solvent odor, quickly dissolves all flux constituents within the solder paste and will not adversely affect stencils that have been nano-coated. C8882 has been proven compatible with all wetted components in automated understencil wipe systems and approved for use by several printer manufactures’. CYBERSOLV C8882 is fast drying without leaving behind any residue.

COMPANY NAME
Kyzen

EMAIL ADDRESS
intlorders@kyzen.com

COMPANY WEBSITE
https://kyzen.com/home

PRODUCT PAGE
https://kyzen.com/cleaning-chemistries/cybersolv/cybersolv-c8882/