U-Bond Technology
C-08A

PRODUCT
C-08A

MANUFACTURER
U-Bond Technology

TARGET TO BE REMOVED
Solder paste

CERTIFICATE
ToxFMD Screened Chemistry

EXPIRATION
8/9/2025

CLEANING METHOD - AUTOMATIC OR MANUAL
Online cleaning

CONCENTRATION
-

OBJECTS
-

MATERIAL COMPATIBILITY
Used for solder paste stencil online cleaning. Fast evaporation and no residue

PRODUCT DESCRIPTION
Solvent-based cleaning agent. It consists of a mixture of high purity alkanes and alcohols. The cleaning agent has the characteristics of quick evaporation and strong cleaning ability. The cleaning agent itself has no corrosive effect on materials such as PCB. It is RoHS and REACH-compliant and contains no halogen, ODS or PAHs.

COMPANY NAME
U-Bond Technology

EMAIL ADDRESS
adhesive@ubondtech.com

COMPANY WEBSITE
http://en.ubondtech.com/

PRODUCT PAGE
http://en.ubondtech.com/product/44.html