Hydron SE 230A 

PRODUCT
Hydron SE 230A 

MANUFACTURER
Zestron

TARGET TO BE REMOVED
Flux residual

CERTIFICATE
GreenScreen Certified Gold

EXPIRATION
7/31/2027

CLEANING METHOD - AUTOMATIC OR MANUAL
Ultrasound/spray/centrifugal/dip

CONCENTRATION
Concentration (15%-30%)

OBJECTS
leadframes, discrete devices, power modules, power LEDs, flip chip, CMOS, wafer

MATERIAL COMPATIBILITY
High level of material compatibility on sensitive materials such as copper, aluminum and specifically nickel

PRODUCT DESCRIPTION
● HYDRON® SE 230A provides stainless, activated copper surfaces for subsequent processes such as wire bonding, moulding and adhesive bonding and retains these activated surfaces over a temporary storage time.
● High level of material compatibility on sensitive materials such as copper, aluminum and specifically nickel.
● Featuring a very low surface tension, it works exceptionally well for cleaning capillary spaces, i.e. underneath
low stand-off components.
● Provides excellent results for defluxing after wafer bumping in single & batch wafer processing equipment.
● Due to its single-phase formulation, it can be easily processed and provides excellent performance in dip tank
processes.
● It can be easily rinsed off with DI-water without leaving any residues, has no flash point and a low odor.

COMPANY NAME
Zestron

EMAIL ADDRESS
infousa@zestron.com

COMPANY WEBSITE
https://www.zestron.com/us/atronr-ac-207.html

PRODUCT PAGE
https://www.chemworks.org/registry/hydron-se-230a