Vigon A 201

PRODUCT
Vigon A 201

MANUFACTURER
Zestron

TARGET TO BE REMOVED
Flux residual, Solder paste

CERTIFICATE
ToxFMD Screened Chemistry, GreenScreen Certified Gold

EXPIRATION
7/31/2027

CLEANING METHOD - AUTOMATIC OR MANUAL
Spray-in-air/Centrifugal Cleaning

CONCENTRATION
Concentration (Batch 20%-30%, Inline 10%-20%)

OBJECTS
Low solid/Rosin based/Water soluble flux residues; Solder paste (Unsoldered), SMT or conductive adhesives

MATERIAL COMPATIBILITY
Its excellent compatibility with sensitive metal alloys leads to shiny solder joints.

PRODUCT DESCRIPTION
Water-based defluxing agent for spray-in-air cleaning processes-
VIGON® A 201 provides excellent cleaning performance in spray-in-air cleaning processes for the cleaning of capillary spaces, e.g. under low standoff components. Used at low concentrations, the MPC®-based cleaning agent VIGON® A 201 is especially suitable for removing flux residues from leaded as well as lead-free No-Clean solder pastes. Its excellent compatibility with
sensitive metal alloys leads to shiny solder joints after cleaning without the need for any additives.

COMPANY NAME
Zestron

EMAIL ADDRESS
infousa@zestron.com

COMPANY WEBSITE
https://www.zestron.com/us/atronr-ac-207.html

PRODUCT PAGE
https://www.chemworks.org/registry/vigon-a-201